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Electronics

SimuTech Group has over 25 years of expertise in simulating a wide variety of electrical and electronic applications.  We have worked on projects in a number of disciplines within the electronics field.  Specifically, we have simulation experience in the product drop testing, Integrated Circuit (IC) package and device reliability, wafer fabrication processes, MEMS technology development, solar cell mechanical integrity, electronics cooling and thermal management, nanotechnology and its mechanics, and seismic/shock/vibration mechanical responses of electronic equipment and enclosures.

Our projects include the use of ANSYS FEA (finite element analysis) structural, thermal and electromagnetic analyses as well as CFD (computational fluid dynamics) analyses to help our customers answer questions arising throughout their product development cycle, from early concept refinement studies to later-stage manufacturability improvement efforts.  Our engineering contributions to our clients involve projects in manufacturability, performance, and reliability.  We have advanced our customers’ knowledgebase by performing advanced simulation studies of complex models such as the chemical vapor deposition processes in the semiconductor device manufacturing, complex 3D chip packaging stresses, and solder joint reliability predictions.

Major electronics corporations, large research institutions as well as small start-up companies have turned to SimuTech to meet their engineering analysis needs for various products within the electronics industry infrastructure.  We pride ourselves in being responsive to each client’s particular needs, from initial, quick concept development analyses to in-depth, highly complex multi-disciplinary analyses.  Our staff of over 40 advanced-degreed engineering professionals has the breadth and depth of experience to support our customers’ individual project requirements in the electronics industry.

Semiconductor Manufacturing
Semiconductor Design
MEMS Design
Consumer Electronics
Aerospace and Automotive Electronics
Computer and Storage Devices
Networking and Communication Equipment
Industrial Equipment and Power Electronics

Semiconductor Manufacturing

Silicon Wafer (Die) Manufacturing

  • Deposition: (CVD, plasma CVD, ALD
  • Dry etch: (metal, silicon, dielectric)
  • Chemical mechanical planarization
  • Electroplatingo
  • Epitaxy
  • Rapid thermal processing
  • Wet chemical cleaning
  • Ion implantation
  • Lithography exposure

Package Manufacturing

  • Encapsulation and curing

Semiconductor Design

Integrated Circuts, Memory, Graphics Chips, RF Devices

Package Mechanical Reliability

  • Thermomechanical stress
  • Solder joint fatigue
  • Vibration and drop test

Electromagnetic Analysis

  • Interconnect parasitic extraction
  • Crosstalk and signal integrity

Thermal Management

  • Package thermal design
  • Die temperature profile

MEMS Design

Sensors, Actuators, Gyroscopes, Transducers, Thermal-Electric Coolers

Strong Interest in Physics Coupling

  • Piezoelectricity and Piezoresistivity
  • Electroelastic analysis
  • Thermal-structural coupling
  • Thermal-electric coupling
  • Thermal-electric-structural coupling

Consumer Electronics

MP3 players, Smart Phones, Game Counsels, Flat Screen TVs, GPS

Mechanical Reliability

  • Random Vibration
  • Drop test
  • Modal analysis

Electromagnetic Analysis

  • Antenna design
  • Human EM shielding
  • EM interference between devices

Thermal Management

  • Air cooling
  • Device enclosure temperature

Aerospace and Automotive Electronics

Automotive: Engine and safety controls, navigation, audio, LEDs

Aerospace: Avionics controls, airborne communication, surveillance and guidance systems, radar

Mechanical Reliability

  • Stress and deformations
  • Random shock and vibration
  • Modal analysis

Electromagnetic Analysis

  • Signal shielding
  • Antenna and radar design

Thermal Management

  • Natural and forced convection air cooling
  • Strong interest in PCB thermal analysis
  • Interest in trace joule heating

Computer and Storage Devices

PCs, Servers, Super Computers, Hard Drives, Networking Storage Devices

Mechanical Reliability
  • Vibration and drop test
  • Rotordynamics
  • Modal analysis
  • Disk drive flutter (FSI)

Electromagnetic Analysis

  • Human EM shielding
  • EM interference between PCBs and traces on PCBs

Thermal Management

  • Thermally-induced deflections in disk drive
  • Forced air cooling
  • Use of heat pipes, spray and emersion cooling

 

Networking and Communication Equipment

Routers, Switches, Base Stations

Mechanical Reliability

  • Random vibration
  • Drop test

Electromagnetic Analysis

  • EM Shielding in enclosures
  • EM interference between PCBs and traces on PCBs

Thermal Management

  • Mostly forced air cooling

Industrial Equipment and Power Electronics

Electric Motors, Electric Converters, Switches, Transformers, Power Supplies

Mechanical Reliability

  • Random vibration
  • Modal analysis
  • Thermomechanical stress

Electromagnetic Analysis

  • EM shielding of enclosures
  • Electrostatic analysis

Thermal Management

  • Natural and forced convection air cooling
  • Interest in trace joule heating